OEM
CB2 3D Printer Motherboard Upgrade with Cooling Heatsink
CB2 3D Printer Motherboard Upgrade with Cooling Heatsink
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Keep your 3D printer running at peak performance with the CB2 Motherboard Upgrade featuring a cooling heatsink. It prevents overheating during intensive projects and ensures consistent, high-speed printing.
Key Features
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Efficient Cooling: Built-in heatsink keeps components stable under heavy loads.
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High-Speed Performance: Rockchip RK3566 @1.8GHz handles demanding printing tasks.
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Large Storage: 32GB eMMC supports large firmware and project files.
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Advanced Project Ready: Perfect for professional and high-speed printing setups.
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Reliable Connectivity: 1000M Ethernet ensures fast, stable communication.
Specifications
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SoC: Rockchip RK3566 @1.8GHz
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RAM: 2GB LPDDR4
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ROM: 32GB eMMC
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PCle: PCle 2.1
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Ethernet: 1000M
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Project Level: Advanced, high-speed printing
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Special Feature: Integrated cooling heatsink
Package Contents
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CB2 Motherboard with Heatsink
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User Manual
What Makes This a Smart Buy:
The integrated heatsink ensures your printer operates reliably even during long or complex prints, reducing downtime and maintaining top-quality performance.
